Die Bonders - Model UDB-140B

Local Time at Hybond: Sunday, 24 September 2023, 8:50 PM

Model UDB-140B Eutectic Die Bonder

Model UDB-140B Epoxy / Silver Glass Bonder


Model UDB-140B is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over, and versatility are integral with the design.

The UDB-140B is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. A preform pick up system and a 4:1 X-Y manipulator for package location can be added depending on the application.

The UDB-140B is modular and easily adapted to various modifications. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application.

Standard Features

  • Black & White CCTV System
  • Heated nitrogen cover gas
  • Preform pickup cycle
  • Manual and semiautomatic operation
  • Adjustable scrub time
  • Single axis scrub
  • Manual X-Y alignment stage
  • Waffle pack / loose die pickup pedestal
  • Pitch & Roll adjustments for bond head
  • Independent head and stage temp. control
  • Adjustable scrub amplitude
  • PLC Control

Optional Features

  • Die Ejector Systems
  • Color CCTV System
  • Zoom Stereo Microscope w/ Swivel Base
  • Dual fiber-optic illumination system
  • Heated N2 gas package enclosure
  • Variable time -ramped temperature generator
  • Lead frame indexing systems
  • Semi-automatic indexing systems
  • Remote Pendant Controls
  • Laser diode alignment search height pause
  • Customization based on specific application


» Scrub System:

Single axis: Magnetic coil @ 50/60 Hz

» Scrub Amplitude:

0 - 25 mils (0 - 635µm)

» Bond (Scrub) Time Range:

0 to 15 seconds

» Dwell Time (before scrubbing):

0 to 15 seconds

» Bond Force Range:

5 to 50 grams (standard)

» Temperature Control Range:

Stage: Ambient to 500° C, Collet: Ambient to 250° C

» Bondable Die Size Range:

6 x 6 mils (152 x 152 µm) to 750 x 750 mils (1,9 x 1,9 µm)

» Placement Accuracy:

± 1 mil (25,4 µm) standard. Higher accuracy when adding other options.

» Bondable Preform Alloys:

AuSn, AuSi, AuGe, and others

» Bond Head Movement:

Motorized, rotational, w/ fixed pick-up and placement points

» Bond Actuation:

By opto-switch at fixed height. Cycle initiated by footswitch.

» Vertical Bonding Window:

0.5 in (1.20 cm) / 0.125 to 0.500 in. (0,31 to 1,20 cm)

» Table Motion:

Manual, with thumbscrew adjustments (standard)

» Approx. Units Per Hour (UPH):

90 - 240 depending on options and settings

» Min. Bench Space Required:

18" W 18" H x 22 " Dp (46cm x 46cm x 56cm) (Bonder only)

» Facilities Required (min.):

Vacuum: 23 inHg. Inert gas (if required): 60psi

» Input Power Requirements:

120 VAC 50/60 Hz @ 8 amps

» Unit Weight /Shipping Weight:

75 / 150 lbs (34 / 68 Kg). Shipping weight will vary