Die Bonders - Model EDB-140A

Local Time at Hybond: Friday, 24 November 2017, 1:04 AM

Model EDB-140A Epoxy / Silver Glass Die Bonder

Model EDB-140A Epoxy / Silver Glass Die Bonder

Overview

Model EDB-140A is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement.

The EDB-140A can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with Hybond's micro-dispense head for extremely low volume epoxy dispensing.

This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system.

The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages.

Standard Features

  • Black & White CCTV System
  • Package depth sensor for consistent & precise bond line thickness
  • Programmable dispense control unit
  • Storage for up to 99 dispense programs
  • Manual X-Y alignment
  • Waffle pack / loose die pickup pedestal
  • Pitch & Roll adjustments for bond head
  • Custom dispense heads / dispense patterns
  • Custom die collets to match customer die
  • Manual & Semiautomatic operation modes
  • PLC Control

Optional Features

  • Die Ejector Systems
  • Color CCTV System
  • Zoom Stereo Microscope w/ Swivel Base
  • Dual fiber-optic illumination system
  • Stir column for Silver Glass / Epoxy
  • Micro-Dispensing head and Control Box
  • Lead frame indexing systems
  • Semi-automatic indexing systems
  • Remote Pendant Controls
  • Remote Pendant Controls
  • Customization based on specific application

Specifications

» Dispense System:

Programmable, Positive pressure system (standard)

» Dispense Materials:

Epoxy, conductive silver glass

» Bond Time Range:

7 to 15 seconds

» Bond Force Range:

15 to 50 grams (standard)

» Temperature Control Range:

Ambient

» Bondable Die Size Range:

6 x 6 mils (152 x 152 µm) to 750 x 750 mils (1,9 x 1,9 µm)

» Placement Accuracy:

± 1 mil (25,4 µm) standard. Higher accuracy when adding other options.

» Bond Line Accuracy:

±.0.5 mil (±m12,7 lµm)

» Bond Head Movement:

Motorized, rotational, w/ fixed pick-up and placement points

» Bond Actuation:

By opto-switch at fixed height. Cycle initiated by footswitch.

» Vertical Bonding Window:

0.5 in (1.20 cm) / 0.125 to 0.500 in. (0,31 to 1,20 cm)

» Table Motion:

Manual, with thumbscrew adjustments (standard)

» Approx. Units Per Hour (UPH):

90 - 240 depending on options and settings

» Min. Bench Space Required:

24" W x 24" H x 22" Dp (61cm x 61cm x 56 cm) (Bonder only)

» Facilities Required (min.):

Vacuum: 23 inHg Air: 60psi

» Input Power Requirements:

120 VAC 50/60 Hz @ 8 amps

» Unit Weight /Shipping Weight:

75 / 150 lbs (34 / 68 Kg). Shipping weight will vary.