Die Bonders

Local Time at Hybond: Friday, 23 June 2017, 1:31 PM

Model EDB-141 Epoxy/Silver Glass Die Bonder

The EDB-141 Epoxy/Silver Glass Die Bonder is a semiautomatic epoxy/silver glass die bonder featuring selectable dispense patterns. It provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. It has a bond line accuracy of 12.7 microns. It can handle die sizes up to 25mm standard, and can store 200 dispense programs .

Model EDB-140B Epoxy Die Bonder

The EDB-140B Semi-automatic Epoxy Die Bonder can dispense epoxy, conductive epoxy or silver glass with a bond line accuracy of 12.7 microns. It can handle die sizes up to 25mm, standard. It can store 200 dispense programs .

Model UDB-141 Eutectic Die Bonder

The UDB-141 Semi-automatic Eutectic Die Bonder has a standard placement accuracy of 25 microns and can be as low as 12.5 microns with minor changes. It features single footswitch operation for pick and place. A turret head allows the machine to pickup preforms and die with separate collets.

Model UDB-206A Eutectic Die Bonder

Model UDB-206A Manual Eutectic Die Bonder bonds devices using heat and vibration at an ultrasonic frequency. It provides precise control of ultrasonic scrub energy, force, and time (scrub duration) to provide consistant wetting without damaging die. The UDB-206A is ideal for low to medium volume and high reliability production.

HY-Pulse 900A Fluxless /Eutectic Solder Station

The HY-Pulse 900A is a stand-alone unit for fluxless soldering applications, or can be used in conjunction with the UDB-140B.