Overview
The DFS-II measures a bonder?s dynamic force in real time. When the tip of a bonding tool presses against the sensor, the CRT will display a wave form that represents the duration and magnitude of the bond head force. This information is measured in milliseconds and grams and can show potentially damaging conditions ranging from head bounce to table vibration to force and/or time inconsistencies.
The DFS-II simplifies the setup of machines of different makes and models by matching the force and time settings regardless of the bonder?s front panel adjustments or difference in calibration.
The built-in four color plotter allows for hard copy documentation of force measurements and can plot a reference trace superimposed on any measurement taken for comparison. The DFS-II is used for calibration, troubleshooting and training.
Uses
- Bond performance evaluation
- Provides essential quality control data
- Measurement & display of bond force profile
- Automatic, semiautomatic, and manual wire bonder applications
- Portable diagnostic tool for bonder adjustment and repair
- Printed record of dynamic force profile
Features
- Real-time clock with battery backup
- Multiple measurement ranges
- Internal 4-color plotter
- Data transfer via RS-432 port
Specifications
» Instrumentation Force Range:
0 - 8000 grams
» Sensor Force Range:
10 - 1000 grams. Higher forces will damage sensor.
» Operating Temp. (std. sensor):
Ambient
» Operating Temp. (high temp. sensor):
160° C
» Max Sample Rate:
100 megahertz/sec
» Input Power Requirements:
90 to 130 VAC 45 - 440 Hz or 190 to 265 VAC 45 - 440 Hz
» Unit Weight:
16 lbs. (7.3 Kg) approximate
