Overview
Model 616B-005 thermosonic single channel peg bonder has been designed to perform thermosonic attachment of insulated or bare wire / ribbon.
This unit contains a built-in in temperature controller.
Applications include hard disk head stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding, and mesh bonding.
Standard Features
- Hybond Soft Touch energy system
- Servo-motor vertical (Z axis) control
- 0.75in (19mm) vertical bonding window
- Variable height bonding within 0.75in (19mm)
- Search height adjustable in 0.001in (25um) increments
- Hi/Lo U/S power selector (PLL generator)
- Digital parameter adjustment in actual units (watts, milliseconds and grams)
- Storage for up to ten bond schedules in nonvolatile memory.
- Built-in temperature controller. Bond counter records number of bonds performed and can be reset.
- Dual footswitch control for bond head vertical (up and down) movement.
- Bond head vertical movement can be controlled in fast or slow speeds on manual mode.
- Bond level sensor system stops Z axis movement upon contact with bond surface and activates bond cycle.
- Deep access when using 0.750 inch tool.
Optional Features
- Leica S7E Zoom Stereo Microscope. (OP-06S7E)
- Nikon SMZ745 Microscope (OP-06B)
- Dual Fiber Optic Illuminator (OP-08A-LED)
- White LED Ring Illuminator (OP-08R1-LED)
- Provisions for 240VAC 50/60 Hz power (OP-12)
- Heated Work Stage, 2.125 in. top (WST-15A)
- Heated Work Stage, 2.125" top with (OP-47) 2 x 2" Waffle Pack/Tray holder (WST-15A-WP)
- Beam Lead Diode Bonding option (OP-47)
- PT-X.X: Peg Tool as ordered per application.
- Beam Lead Diode Bonding Tool (BLD-TxWxL)
Specifications
» Ultrasonic System:
PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
» Ultrasonic Power Range:
0-2 watt on Low setting, 0-4 watts on High setting
» Bond Time Range:
0 - 900 mSec
» Bond Force Range:
12 - 300 grams
» Temperature Control Range:
15 to 250° Centigrade
» Bondable Wire Diameters:
0.7 to 3.0mil (18 to 76um) and ribbon up to 1 x 20mil (25 x 500um)
» Bond Head Movement:
True linear vertical motorized movement with fast and slow speeds in manual mode or search height pause in auto mode
» Bond Actuation:
Bond height sensor activates bond cycle upon contact with bond surface/overtravel
» X-Y Work Platform Motion:
Manual, 4:1 ratio between manipulator and X-Y table
» Input Power Requirements:
120 VAC 50/60 Hz @ 10A (std), order OP-12 for 240VAC 50/60Hz
» Minimum Bench Space Required:
20" x 20" (50,8cm x 50,8cm)
» Unit Weight /Shipping Weight:
45 / 135 lbs (20,41 / 61,24 Kg). Shipping weight will vary.
» Industry Standards:
CE certified
