Peg Bonders - Model 616B-001

Local Time at Hybond: Friday, 24 November 2017, 1:06 AM

Model 616B-001 Digital Ultrasonic Peg Bonder

Model 616B-001 Digital Ultrasonic Peg Bonder

Overview

Model 616B-001 Digital Ultrasonic Peg Bonder is designed for ultrasonic bonding of interconnects in applications that do not require the bonder to feed wire.

Applications include "tacking" tuning ribbons, insulated wire bonding, flex on flex bonding, pin tab bonding, mesh bonding , and ball coining.

When fitted with a WP-280 and OP-75, the 616B-001 becomes a semiautomatic machine for medium to high volume production.

Standard Features

  • Hybond Soft Touch energy system
  • Servo-motor vertical (Z axis) control
  • 0.75 inch vertical bonding window
  • Variable height bonding within 0.75 inch
  • Search height adjustable in 0.001 inch increments
  • Hi / Low Ultrasonic Power (PLL Generator)
  • Digital Parameter adjustment in actual units
  • Storage for up to 10 bond schedules
  • Dual bond counters for tool use & total bonds
  • Dual footswitch control for vertical movement
  • Fast or slow Z-axis movement in manual mode
  • Deep access when using 0.75" wedge
  • Wiring for 120 VAC 50/60Hz @ 10A Max.

Optional Features

  • Leica Stereo Zoom microscope (OP-06S6T)
  • Nikon SMZ660 microscope (OP-06A)
  • Dual fiber-optic illuminator (OP-08A)
  • 240 VAC 50/60 Hz input wiring (OP-12)
  • Heated workstage, 2.125" top (WST-15A)
  • Heated workstage, 4"x 4" top (WST-19B)
  • Peg Tool (PT-X.X)

Specifications

» Ultrasonic System:

PLL self-tuning, 62.5 KHz (±2.5KHz) nominal

» Ultrasonic Power Range:

0-2 watt on Low setting, 0-4 watts on High setting

» Bond Time Range:

0 - 900 mSec

» Bond Force Range:

12 - 300 grams

» Bondable Wire Diameters:

0.5 to 2.0 mils (12,5 to 50 µm) insulated ; 0.5 to 2.0 mils (12,5 to 50 µm) bare

» Bondable Ribbon Dimensions:

Up to 2 x 20 mils (50 x 500 µm)

» Bondable Wire /Ribbon Materials:

Gold, gold plated copper, and aluminum

» Bond Head Movement:

True vertical motorized movement

» Bond Actuation:

Sensor at variable height, actuated by contact with bond surface

» Z Axis Travel:

0.75 in (19 mm)

» Vertical Bonding Window:

0.75 inch (19 mm)

» Input Power Requirements:

120 VAC 50/60 Hz @ 10A (std) or 240 VAC 50/60 Hz @ 5A

» Minimum Bench Space Required:

20" x 20" (50,8cm x 50,8cm)

» Unit Weight /Shipping Weight:

45 / 135 lbs (20,4 / 61,2 Kg). Shipping weight will vary.

» Industry Standards:

CE certified