Overview
The 522A-40 incorporates Hybond's exclusive Soft Touch™ force ramping system that bonds effectively even to sensitive materials.
Superior wire control is provided by a motorized feed system which features front panel operator adjustment of tail length.
Model 522A-40 sets the industry standard for ease of operation and maintenance. Front panel operator controls include force, ultrasonic time, ultrasonic energy, tail length, EFO power, and stage heat.
The 4:1 X-Y manipulator stage movement and Z axis bond motion are conveniently located to reduce operator fatigue.
Precision machined mechanical components with sealed ball bearings at major points are durable and trouble-free. Modular electronics facilitate quick and cost-effective maintenance.
Standard Features
- Hybond Soft Touch energy system
- Independent Z-axis lever for bonding tool control
- Motorized vertical wire feed
- 1-2-2 stitch capability
- 0.5 and 2 inch spool mounts
- Loop height control adjustment
- Electronic ball size control
- Swing-away wire clamp assembly
- Deep vertical access of 0.53 inch
- Long horizontal reach of 6.5 inches
- High and Low EFO power
- Independent control of 1st & 2nd bond parameters
- Tail length adjustable
- Audio & visual bond sequence fault indicators
- 10 x 12 inch work platform
- LED display of work stage temperature
- Infinite angle microscope mounting
- Front panel ultrasonic test button
- Comfortably fits 10 x 10 inch module or substrate
Optional Features
- Leica S7E Zoom Stereo Microscope (OP-06S7E)
- Nikon SMZ745 Microscope (OP-06B)
- Dual Fiber Optic Illuminator (OP-08A-LED)
- White LED Ring Illuminator (OP-08R1-LED)
- 240VAC 50/60Hz Input Wiring (OP-12)
- Board for Bump Bonding (OP-13)
- 8:1 X-Y Manipulator (OP-30A)
- Tool Heater and Temp. Controller (OP-31)
- Beam Lead/Die Pick, Place and Bond (OP-47)
- Heated Transducer for Tool Heat (OP-82)
- Heated Work Stage, 2.125 in. top (WST-15A)
- Heated Work Stage, 4 x 6 in. top (WST-19A)
- Heated Work Stage, 10 x 6 in top (WST-65)
- Wire & Capillary as ordered per application
Specifications
» Ultrasonic System:
PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
» Ultrasonic Power Range:
0-1 watt on Low setting (default), 0-2 watts on High setting
» Bond Time Range:
10 - 400 mSec
» Bond Force Range:
15 - 150 grams
» Temperature Control Range:
Ambient to 250° C
» Bondable Wire Diameters:
0.7 to 2.0 mils (18 to 50,8 µm)
» Bondable Wire Materials:
Gold wire
» Bonding Capillary Length:
0.750"
» Bond Head Movement:
Manual
» Bond Actuation:
Switch at fixed height, actuated by lever
» Z Axis Travel:
0.5 in (1,20 cm) maximum
» Vertical Bonding Window:
60 -100 mils (152-254 µm) max dist. between 1st & 2nd bond
» Table Motion:
4:1, manual
» Input Power Requirements:
120 VAC 50/60 Hz @ 10A (std) or 240 VAC 50/60 Hz @ 5A
» Minimum Bench Space Required:
20" x 25" (50,8cm x 63,5cm)
» Unit Weight /Shipping Weight:
70 / 150 lbs (50,8 / 63,5 Kg). Shipping weight will vary.
» Industry Standards:
CE certified
